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Microscope optics for the inspection of electronic boards and tiny components
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The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 28 μm.  The distance between the measurement object and the camera can vary between 80 and 100 mm.

  • Analysis of small chip level components down to 28 μm
  • Hands-free operation for simultaneous testing and IR imaging
  • Exchangeable, focusable lenses for most flexible use of the camera
  • With a Temperature resolution (NETD) of 80 mK

Applications

The optris Microscope optics are ideally suited to thermally analyze both entire circuit boards and detailed macro shots of individual components can be measured reliably. The high-quality thermal and geometric detail resolution of the infrared cameras allows for an effective and precise functional testing of electronic products.

Software

All IR cameras are delivered with the thermography software optris PIX Connect, which has been developed specifically for the extensive documentation and analysis of thermal images. It allows you to analyse temperature data in real time as well as the remote control of your infrared camera. Furthermore, you can setup individual alarm levels for your process and define visual or acustic alarm signals.

Our thermography software is licence free and can easily be adjusted to your requirements. 

All optris infrared cameras are compatible with the Data Aquisition (DAQ)

Scope of supply:

Thermal imaging camera optris PI 640i
• Microscope optics (MO44)
• Microscope stand
• Standard USB cable (1 m )
• Standard process interface
• Manual optris PI camera
• Rugged outdoor transport case
• Software package optris PIX Connect on USB flash drive

Technical specifications optris PI Microscope kit

  • Minimum spot size: PI 640i: 28 μm
  • Microscope optics (FOV):
    PI 640i 12° x 9° (F=1.1) / f= 44 mm
  • Working distance: 80 – 100 mm
  • Temperature range (scalable):
    –20 ... 100 °C, 0 ... 250 °C, 150 ... 900 °C
  • PI 640i FPA,
    640 x 480 pixels @ 32 Hz
    640 x 120 pixels @ 125 Hz
  • Spectral range 8 – 14 μm
  • System accuracy (at ambient temperature 23 ± 5°C): ±2 °C or ±2 % , whichever is greater
  • Ambient derating: ± 0,05 %/K 1)
  • Temperature resolution (NETD)
    PI 640i: 80 mK
  • PC interface: USB 2.0
  • Standard process interface (PIF)
    0–10 V input, digital input (max. 24 V), 0–10 V output
  • Industrial process interface (IPF)
    2x 0–10 V input, digital input (max. 24 V),
    3x 0–10 V output, 3x relay (0–30 V / 400 mA), fail safe relay
  • Cable length (USB): 1 m (standard), 3 m, 5 m, 10 m, 20 m
  • Ambient temperature:
    PI 640i: 0 ... 50 °C 
  • Storage temperature: –40 ... 70 °C 
  • Relative humidity: 10 - 95 %, non-condensing
  • Enclosing2) (size / rating): 46 mm x 56 mm x 130 mm / IP 67 (NEMA 4)
  • Weight 370 g, incl. lense
  • Shock/Vibration2) IEC 60068-2
  • Tripod mount 1/4 – 20 UNC
  • Power supply via USB
  • Emissivity 0.100...1.100
  • Software optris PIX Connect / Windows and Linux SDKs